The Effect of Thermal Annealing on the Adherence of Al_2O_3-Films Deposited by Low-Pressure, Metal-Organic, Chemical-Vapor Deposition on AISI 304

摘要

Thin alumina films, deposited at 280℃ by low-pressure, metal-organic, chemical-vapor deposition on stainless steel, type AISI 304, were annealed at 0.17kPa in a nitrogen atmosphere for 2, 4, and 17 hr at 600, 700, and 800℃. The effect of the annealing process on the adhesion of the thin alumina films was studied using a scanning-scratch tester, type SST-101, developed by Shim-adzu. The best mechanical properties were obtained with unannealed samples. After thermal annealing the critical load decreased, proportional to annealing time and/or temperature. This effect was probably due to the presence of a high thermal stress and to preferential segregation of sulfur near the oxide-alloy interface.