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Materials for LiGA and LiGA-based microsystems

机译:LiGA和基于LiGA的微系统的材料

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摘要

The LiGA technique that has been developed for the inexpensive mass fabrication of microdevices consists of three basic processes: X-ray lithography, electroforming and moulding. In each of these steps the properties of the used materials and the process parameters are strongly correlated to each other. Thus, optimizing processes requires detailed knowledge of the materials properties especially as the LiGA technique offers an extremely broad variety of materials (polymers, metals, alloys, ceramics) for the fabrication of three-dimensional microstructures. When it comes to specific applications of LiGA devices, it is often desirable to tailor the properties of materials and surfaces e.g. in respect to mechanical properties, optical properties, thermo- and electrochemical stability and biocompatibility. Again, a detailed knowledge of the properties of the various materials is crucial to optimize these tasks, keeping in mind that these properties on the microscale can differ from those of bulk materials.
机译:为廉价地大规模制造微型设备而开发的LiGA技术包括三个基本过程:X射线光刻,电铸和成型。在这些步骤的每个步骤中,所用材料的属性和工艺参数之间都紧密相关。因此,优化工艺需要详细了解材料特性,特别是因为LiGA技术为制造三维微结构提供了种类繁多的材料(聚合物,金属,合金,陶瓷)。当涉及到LiGA器件的特定应用时,通常需要调整材料和表面的特性,例如:在机械性能,光学性能,热和电化学稳定性以及生物相容性方面。同样,详细了解各种材料的性能对于优化这些任务至关重要,同时请记住,这些微观尺寸的性能可能与散装材料的性能不同。

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