首页> 外文期刊>Nuclear Instruments & Methods in Physics Research. B, Beam Interactions with Materials and Atoms >Effects of consecutive processing between cleaning and deposition on adhesion of diamond-like carbon prepared by plasma-based ion implantation and deposition
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Effects of consecutive processing between cleaning and deposition on adhesion of diamond-like carbon prepared by plasma-based ion implantation and deposition

机译:清洗和沉积之间连续进行的处理对通过基于等离子体的离子注入和沉积制备的类金刚石碳的附着力的影响

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摘要

The effects of pretreatment on adhesion, which is the most important challenge of diamond-like carbon (DLC) films, were investigated. DLC films were prepared by changing pretreatment conditions on austenitic stainless steel (SUS304) substrates by hybrid process of plasma-based ion implantation and deposition (PBIID) using superimposed RF and negative high-voltage pulses. Although an oxide layer on a substrate surface was removed by Ar-plasma sputter cleaning, the substrate surface was immediately reoxidized when plasma was stopped for a moment between sputter cleaning and deposition. The DLC film on the oxide layer was poor adhesion strength less than approximately 50 MPa. Even if the oxide layer existed on the substrate surface, carbon ion implantation as an interface treatment in the PBIID process broke the oxide layer. As a result, the adhesion strength of DLC films was enhanced above the strength of epoxy resin (about 70 MPa). Furthermore, it was found that continuous generation of plasma after sputter cleaning was able to suppress reoxidation of the substrate surface. Consequently, the adhesion strength of DLC films prepared with no interface treatment was increased above 70 MPa, suggesting simplification of coating process and reduction in processing time for cost reduction.
机译:研究了预处理对粘附的影响,粘附是类金刚石碳(DLC)膜的最重要挑战。通过使用叠加的RF和负高压脉冲通过基于等离子体的离子注入和沉积(PBIID)的混合过程,通过改变奥氏体不锈钢(SUS304)基板上的预处理条件来制备DLC膜。尽管通过Ar-等离子体溅射清洁去除了衬底表面上的氧化物层,但是当在溅射清洁和沉积之间的瞬间停止等离子体时,衬底表面立即被重新氧化。氧化物层上的DLC膜的粘合强度差,小于约50MPa。即使在基板表面上存在氧化物层,在PBIID工艺中作为界面处理的碳离子注入也会破坏该氧化物层。结果,DLC膜的粘合强度比环氧树脂的强度(约70MPa)高。此外,发现在溅射清洁之后连续产生等离子体能够抑制基板表面的再氧化。因此,未经界面处理的DLC薄膜的粘合强度增加到70 MPa以上,这表明简化了涂布工艺并减少了加工时间以降低成本。

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