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Hybrid pixel detector based on capacitive chip to chip signal-transmission

机译:基于电容芯片到芯片信号传输的混合像素检测器

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Hybrid pixel-detectors for the detection of elementary particles without bump-interconnections will be presented. The signals, generated in the sensor chip, are transmitted using capacitive coupling to the readout chip. In order to ease the capacitive signal transmission, an active pixel sensor has been used. The sensor chip is implemented in a standard CMOS high-voltage technology where lowly doped n-well in p-substrate diodes are used as pixel-sensors. CMOS in-pixel preamplifiers are implemented inside the n-wells. Experimental results obtained with two different hybrid detector prototypes will be presented.
机译:将介绍用于不具有凸点互连的基本粒子的检测的混合像素检测器。传感器芯片中产生的信号通过电容耦合传输到读出芯片。为了减轻电容性信号的传输,已经使用了有源像素传感器。传感器芯片以标准CMOS高压技术实现,其中p衬底二极管中的低掺杂n阱用作像素传感器。 CMOS像素内前置放大器在n阱内部实现。将介绍使用两个不同的混合探测器原型获得的实验结果。

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