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首页> 外文期刊>Nuclear Instruments & Methods in Physics Research >Impact of the layout on the electrical characteristics of double-sided silicon 3D sensors fabricated at FBK
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Impact of the layout on the electrical characteristics of double-sided silicon 3D sensors fabricated at FBK

机译:布局对在FBK上制造的双面硅3D传感器的电气特性的影响

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摘要

We report on experimental results and TCAD simulations addressing the impact of layout on the electrical characteristics of double-sided 3D diodes fabricated at Fondazione Bruno Kessler (FBK), Trento, Italy. Simulations are found to accurately reproduce the device characteristics, thus explaining the basic mechanisms governing the breakdown behavior and capacitance of different devices and providing useful hints for layout optimization.
机译:我们报告实验结果和TCAD仿真,以解决布局对在意大利特伦托的Fondazione Bruno Kessler(FBK)制造的双面3D二极管的电气特性的影响。发现仿真可以准确地再现器件特性,从而解释了控制不同器件的击穿行为和电容的基本机制,并为布局优化提供了有用的提示。

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  • 作者单位

    Dipartimento di Ingegneria e Scienza dell'lnformazione, Universita di Trento. Via Sommarive, 14, I-38123 Povo di Trento (TN), Italy,INFN, Sezione di Padova (Gruppo Collegato di Trento), Italy;

    Fondazione Bruno Kessler, Centra per i Materiali e i Microsistemi (FBK-CMM), Via Sommarive, 18, I-38123 Povo di Trento, TN, Italy;

    Fondazione Bruno Kessler, Centra per i Materiali e i Microsistemi (FBK-CMM), Via Sommarive, 18, I-38123 Povo di Trento, TN, Italy;

    Dipartimento di Ingegneria e Scienza dell'lnformazione, Universita di Trento. Via Sommarive, 14, I-38123 Povo di Trento (TN), Italy,INFN, Sezione di Padova (Gruppo Collegato di Trento), Italy;

    Fondazione Bruno Kessler, Centra per i Materiali e i Microsistemi (FBK-CMM), Via Sommarive, 18, I-38123 Povo di Trento, TN, Italy;

    Fondazione Bruno Kessler, Centra per i Materiali e i Microsistemi (FBK-CMM), Via Sommarive, 18, I-38123 Povo di Trento, TN, Italy;

    Fondazione Bruno Kessler, Centra per i Materiali e i Microsistemi (FBK-CMM), Via Sommarive, 18, I-38123 Povo di Trento, TN, Italy;

    Fondazione Bruno Kessler, Centra per i Materiali e i Microsistemi (FBK-CMM), Via Sommarive, 18, I-38123 Povo di Trento, TN, Italy;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    3D detectors; silicon detectors; numerical simulations; TCAD; electrical characterization; test structures;

    机译:3D探测器硅探测器;数值模拟;TCAD;电气特性测试结构;

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