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Detector performance and defect densities in CdZnTe after two-step annealing

机译:两步退火后CdZnTe中的探测器性能和缺陷密度

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摘要

Defects both microscale and nanoscale are play an important role in CdZnTe (CZT) device performance. Typical micro-scale defects such as Te inclusions were removed via a two-step annealing process, and their concentration was analyzed via IR transmission microscopy. In addition, transmission electron microscopy (TEM) measurement was employed to investigate the evolution of nano-scale defects after the annealing process. Dislocation and stacking faults were commonly observed defects in as-grown and annealed CZT. The line shape defects, which are possibly related to the stress field around dislocations, disappeared during the in-situ the annealing at 200-220 C. A Frisch-grid CZT detector made via the two-step annealing process exhibited improved energy resolution and low backscattering counts in Cs-137 gamma spectra.
机译:微米级和纳米级缺陷在CdZnTe(CZT)器件性能中都起着重要作用。通过两步退火工艺去除了典型的微米级缺陷(例如Te夹杂物),并通过红外透射显微镜对其浓度进行了分析。此外,透射电子显微镜(TEM)测量被用来研究退火工艺后纳米级缺陷的演变。错位和堆垛层错是生长和退火后的CZT中常见的缺陷。线形缺陷可能与位错周围的应力场有关,在200-220 C的原位退火过程中消失了。通过两步退火工艺制成的Frisch网格CZT检测器显示出改善的能量分辨率和较低的Cs-137伽玛光谱中的反向散射计数。

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