Japan E.M. Co., Ltd. and NEC Corp. have jointly developed a bump placement system that permits microscopic bumps to be formed in narrow pitches reliably and at low cost on next-generation version LSIs. This new system enables ball-shaped bumps with diameters finer than 100μm to be formed accurately and rapidly in narrow pitches of less than 200μm. The companies established technology to arrange miniscule balls neatly on an alignment plate in an electrically conductive solution for the transfer of these balls, by which the problem of the miniscule balls entangled by electrostatic action, which was encountered in the process previously, has been completely eliminated. The newly established technique is applicable to next-generation version LSI image processing systems having over 5,000 input/output terminals.
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