'Smallest' Point of Load DC-DC converter solutions

摘要

Dialog Semiconductor, working in collaboration with TDK, has brought together its GreenPAK technology with TDK's latest uPOL power solutions to create what it claims is the world's first single-integrated system power sequencing solution. By combining Dialog's scalable, flexible GreenPAK technology with TDK's high-density power module solution it's been possible to reduce the number of required components creating a more compact, reliable, robust solution for powering advanced industrial applications. With Dialog's GreenPAK technology it's possible to reduce production lead times expediting the development of complex system boards. The uPOL solution leverages advanced technology packaging techniques to enable cohesive 3D system integration in a smaller size and lower profile. This integration allows TDK to deliver higher power density and ease of use at a lower total system cost compared to what is currently available today.