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Epitaxial growth and layer-transfer techniques for heterogeneous integration of materials for electronic and photonic devices

机译:外延生长和层转移技术,用于电子和光子设备材料的异质集成

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摘要

The demand for improved electronic and optoelectronic devices has fuelled the development of epitaxial growth techniquesfor single-crystalline semiconductors. However, lattice and thermal expansion coefficient mismatch problems limit the optionsfor growth and integration of high-efficiency electronic and photonic devices on dissimilar materials. Accordingly, advancedepitaxial growth and layer lift-off techniques have been developed to address issues relating to lattice mismatch. Here, wereview epitaxial growth and layer-transfer techniques for monolithic integration of dissimilar single-crystalline materials forapplication in advanced electronic and photonic devices. We also examine emerging epitaxial growth techniques that involvetwo-dimensional materials as an epitaxial release layer and explore future integrated computing systems that could harnessboth advanced epitaxial growth and lift-off approaches.
机译:对改进的电子和光电器件的需求推动了单晶半导体外延生长技术的发展。但是,晶格和热膨胀系数不匹配的问题限制了在异种材料上生长和集成高效电子和光子器件的选择。因此,已经开发了先进的外延生长和层剥离技术来解决与晶格失配有关的问题。在此,介绍了用于异种单晶材料的单片集成的外延生长和层转移技术,以用于先进的电子和光子器件。我们还研究了涉及二维材料作为外延释放层的新兴外延生长技术,并探讨了可以利用先进的外延生长和剥离方法的未来集成计算系统。

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  • 来源
    《Nature Electronics》 |2019年第10期|439-450|共12页
  • 作者单位

    Mechanical Engineering Massachusetts Institute of Technology Cambridge MA USA Research Laboratory of Electronics Massachusetts Institute of Technology Cambridge MA USA;

    Electrical and Computer Engineering University of Virginia Charlottesville VA USA;

    Mechanical Engineering Massachusetts Institute of Technology Cambridge MA USA Research Laboratory of Electronics Massachusetts Institute of Technology Cambridge MA USA Materials Science and Engineering Massachusetts Institute of Technology Cambridge MA USA;

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