ULTRAMINIATURE COAXIAL CONNECTORS FOR SMT APPLICATIONS

摘要

The ever-increasing demand for miniaturization in microwave communications systems and equipment continues to require components that are both smaller and less costly. One of the determinants of size has traditionally been interconnect devices. A new generation of surface-mount technology (SMT) coaxial connectors have been introduced that further miniaturize interconnects and provide cost savings as well. The patented Micro Miniature Pressure Contact (MMP) product line consists of the Ultra Miniature Pressure (UMP) series and the Interconnect Miniature Pressure (IMP) series. The innovative pressure contact concept makes it possible to utilize one coaxial connector where normally two or three are required. The UMP is designed for board-to-board cable link connectors, and the IMP series features board-to-board adapters.