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【24h】 Smart Design Practices Address EMI/EMC Challenges

【摘要】To produce more circuit functionality, leading-edge designs rely on high-speed devices, using the latest IC process nodes and advanced package technologies. As the complexity of these electronic products intensifies, constraining EM emissions within dense printed circuit boards (PCB), IC packages and even the IC itself requires careful engineering. With package pin counts in excess of 5000 and ever-smaller pitch spacing compressed into shrinking board space, the potential for electromagnetic interference is greatly increased. To meet both manufacturer's specifications and engineers' requirements for signal integrity, cross-talk and EMI compliance, designers must be able to identify and constrain critical high-speed signals at all stages of the design process.

【期刊名称】 Microwave Journal

【作者】David Vye;

【作者单位】;

【收录信息】;

【年(卷),期】2007(50),6

【年度】2007

【页码】p.70,72,74,76,78,80,82,84,86

【总页数】9

【原文格式】PDF

【正文语种】eng

【中图分类】TN;

【关键词】;

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