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Fabrication of microfluidic devices for packaging CMOS MEMS impedance sensors

机译:用于封装CMOS MEMS阻抗传感器的微流体器件的制造

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摘要

This work presents a polydimethylsiloxane (PDMS) microfluidic device for packaging CMOS MEMS impedance sensors. The wrinkle electrodes are fabricated on PDMS substrates to ensure a connection between the pads of the sensor and the impedance instrument. The PDMS device can tolerate an injection speed of 27.12 ml/h supplied by a pump. The corresponding pressure is 643.35 Pa. The bonding strength of the device is 32.44 g/mm~2. In order to demonstrate the feasibility of the device, the short circuit test and impedance measurements for air, de-ionized water, phosphate buffered saline (PBS) at four concentrations (1, 2×10~4, 1×10~4, and 6.7×10~(-5) M) were performed. The experimental results show that the developed device integrated with a sensor can differentiate various samples.
机译:这项工作提出了一种用于封装CMOS MEMS阻抗传感器的聚二甲基硅氧烷(PDMS)微流体器件。褶皱电极被制造在PDMS基板上,以确保传感器的焊盘和阻抗仪器之间的连接。 PDMS设备可以承受泵提供的27.12 ml / h的注射速度。相应的压力为643.35 Pa。设备的结合强度为32.44 g / mm〜2。为了证明该设备的可行性,对四种浓度(1、2×10〜4、1×10〜4和4)的空气,去离子水,磷酸盐缓冲盐水(PBS)进行了短路测试和阻抗测量。进行6.7×10〜(-5)M)实验结果表明,与传感器集成的已开​​发设备可以区分各种样品。

著录项

  • 来源
    《Microfluidics and nanofluidics》 |2009年第6期|869-875|共7页
  • 作者单位

    Department of Electrical Engineering, Center for Micro/Nano Science and Technology, National Cheng Kung University,1 University Road, Tainan 701, Taiwan;

    Department of Electrical Engineering, Center for Micro/Nano Science and Technology, National Cheng Kung University,1 University Road, Tainan 701, Taiwan;

    Department of Electrical Engineering, Center for Micro/Nano Science and Technology, National Cheng Kung University,1 University Road, Tainan 701, Taiwan;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    microfluidics; PDMS; package; impedance; CMOS MEMS;

    机译:微流体PDMS;包;阻抗;CMOS微机电系统;

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