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首页> 外文期刊>Microelectronics & Reliability >ELECTROCHEMICAL WET ETCHING m KOH:H2O SOLUTION AND SECONDARY/ION IMAGE PASSIVE VOLTAGE CONTRAST AS A COMPLEMENTARY TECHNIQUE IN FAILURE ANALYSIS
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ELECTROCHEMICAL WET ETCHING m KOH:H2O SOLUTION AND SECONDARY/ION IMAGE PASSIVE VOLTAGE CONTRAST AS A COMPLEMENTARY TECHNIQUE IN FAILURE ANALYSIS

机译:电化学湿蚀刻m KOH:H2O溶液和二次/离子图像被动电压对比作为故障分析中的补充技术

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摘要

It is always a challenge for failure analysis engineer to localize leaky polysilicon gate. One of the common method is to use Passive Voltage Contrast (PVC). If the leakage is low and falls below 1uA (<1uA), it may be difficult to show the contrast between good and bad polysilicon gate using PVC. In this paper, techniques such as secondary/ion image PVC from Scanning Electron Microscope (SEM) / Focus Ion Beam (FIB) and electrochemical wet etching in KOH:H_2O solution are used to detect the leaky polysilicon gate. The latter is used specially for Physical detection, thus enhancing the confidence level of analysis. Both techniques will be used in complimentary manner as a failure analysis tool to detect leaky polysilicon gate.
机译:对于故障分析工程师来说,定位泄漏的多晶硅栅极始终是一个挑战。常见方法之一是使用无源电压对比(PVC)。如果泄漏很低并且降至1uA(<1uA)以下,则可能很难显示使用PVC的好和坏多晶硅栅极之间的对比度。本文采用扫描电子显微镜(SEM)/聚焦离子束(FIB)的二次/离子图像PVC以及在KOH:H_2O溶液中进行电化学湿法刻蚀的技术来检测泄漏的多晶硅栅极。后者专门用于物理检测,从而提高了分析的置信度。两种技术都将以互补的方式用作故障分析工具,以检测泄漏的多晶硅栅极。

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