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A new MOD method to prepare Sr_0.7Bi_2.2Ta_2O_9 ferroelectric films for non-volatile RAM memories

机译:一种新的MOD方法制备用于非易失性RAM存储器的Sr_0.7Bi_2.2Ta_2O_9铁电薄膜

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摘要

Strontium bismuth tantalite, Sr_0.7Bi_2.2Ta_2O_9 (SBT), thin films were prepared by a new metalorganic decomposition (MOD) method using strontium (2,2,6,6-tetramethyl-3,5-heptanedionate), and tantalum ethoxide as the metalorganic precursors. Films with a thickness of 300 nm wer prepared on Si(100) with a layered bottom electrode (Pt/TiO_2SiO_2). After crystallization in oxygen for 60 min at 750 deg C, single orthorhombic-phased films were obtained as determined by XRD, but no preferred crystalline orientation was revealed using this technique. Characterization by AFM showed that the polycrystalline films were densely packed and crackfree, and had an average surface roughness (rms) of 8 nm and a mean grain size of 150 nm. The remnant polarization and coercive field were 6μC cm~-2 and 74 kV cm~-1, respectively. The SBT films showed a very low polarization fatigue after 10~11 switching cycles and good retention properties.
机译:锶铋钽铁矿Sr_0.7Bi_2.2Ta_2O_9(SBT),薄膜是通过使用锶(2,2,6,6-四甲基-3,5-庚二酸酯)和乙醇钽作为新金属有机分解(MOD)方法制备的金属有机前体。在具有层状底部电极(Pt / TiO_2SiO_2)的Si(100)上制备了厚度为300 nm的薄膜。在750℃下于氧气中结晶60分钟后,通过XRD测定获得了单正交相膜,但使用该技术未发现优选的结晶取向。通过AFM的表征表明,多晶膜紧密堆积且无裂纹,并且具有8nm的平均表面粗糙度(rms)和150nm的平均晶粒尺寸。剩余极化和矫顽场分别为6μCcm〜-2和74 kV cm〜-1。 SBT薄膜在10〜11个开关周期后显示出极低的极化疲劳,并具有良好的保持性能。

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