...
首页> 外文期刊>Microelectronics & Reliability >Relation between residual stress and electrical properties of polysilicon/oxide/silicon structures
【24h】

Relation between residual stress and electrical properties of polysilicon/oxide/silicon structures

机译:多晶硅/氧化物/硅结构的残余应力与电性能之间的关系

获取原文
获取原文并翻译 | 示例

摘要

This article deals with the influence of the polycrystalline gate residual stress on the electrical properties of the corresponding metal/polysilicon/oxide/silicon capacitive structures. The flat band voltage V_fb and the oxide charge density N_ox, are shown to depend on the polysilicon residual stress. On real influence is obtained for the dielectric breakdown properties. These results demonstrate that the dielectric improvement obtained for (nitrogen doped or undoped) silicon gates deposite from disilane does not depend on the film mechanical properties bout on other intrinsic properties such as microstructure or roughness.
机译:本文讨论了多晶栅极残余应力对相应的金属/多晶硅/氧化物/硅电容结构的电性能的影响。平坦带电压V_fb和氧化物电荷密度N_ox显示为取决于多晶硅残余应力。介电击穿特性获得了真正的影响。这些结果表明,对于从乙硅烷沉积的(氮掺杂或非掺杂的)硅栅所获得的介电性能提高,并不取决于膜的机械性能,而取决于其他固有性能,例如微观结构或粗糙度。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号