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Interface properties of the Si(100)-SiO_2 system formed by rapid thermal oxidation

机译:快速热氧化形成的Si(100)-SiO_2系统的界面性质

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In this work, the properties f the Si(100)-SiO_2 interface are examined directly following wet and dry rapid thermal oxidation (RTO) at 1000-1100degC. The high frequency and quasi-static CV response of the Si(100)-SiO_2 system are measured using a mercury probe method. The analysis indicates a high interface state density across the band gap for dry oxidation, with a characteristic peak in the range 0.8-0.9 eV above the valence band edge. These interface state profiles are compared to polysilicon/oxide/Si(100)) structures, measured after rapid thermal annealing at 1050 deg C (where the gate oxide is grown by conventional furnace oxidation). The results show a striking similarity, pointing to a common origin for the interfacial defects. Steam-assisted RTO samples do not reveal these peaks, and the reasons for this are presented. The significance of these new results to thin oxide growth and optimization by RTO are discussed.
机译:在这项工作中,直接在1000-1100℃下进行湿法和干法快速热氧化(RTO)之后,直接检查了Si(100)-SiO_2界面的性能。使用汞探针法测量了Si(100)-SiO_2系统的高频和准静态CV响应。分析表明整个带隙的界面态密度较高,可进行干法氧化,其特征峰在价带边缘以上0.8-0.9 eV范围内。将这些界面态轮廓与多晶硅/氧化物/ Si(100))结构进行比较,该结构是在1050摄氏度(通过常规炉氧化生长栅极氧化物)的快速热退火之后测得的。结果显示出惊人的相似性,指出了界面缺陷的共同来源。蒸汽辅助的RTO样品未显示这些峰,并说明了其原因。讨论了这些新结果对薄氧化物生长和RTO优化的意义。

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