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Study of the positive charge buildup into buried oxide of SIMOX SOI structure during bias-temperature stress

机译:偏置温度应力下SIMOX SOI结构埋入氧化物中正电荷累积的研究

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The buildup of fixed and mobile charge in the buried oxide (BOX) of silicon implanted by oxygen (SIMOX) silicon-on-insulator (SOI) structures during bias-temperature (BT) cycling has been studied by the thermally stimulated polarization (TSP) current technique and C-V measurements. Two polarization processes have been observed: the first process with activation energy of 0.3 eV is likely related to the positively charged ion transport across the BOX, the second process with activation energy about 1.2 eV is associated with space charge polarization. It was found that the ion transport is created simultaneously with the process of lateral positive charge buildup near the BOX/substrate interface when the bias is applied t the structure at temperatures above 280degC.
机译:通过热激发极化(TSP)研究了在偏置温度(BT)循环过程中,氧(SIMOX)绝缘体上硅(SOI)结构注入的硅的掩埋氧化物(BOX)中固定电荷和移动电荷的积累当前的技术和CV测量。已经观察到两个极化过程:活化能为0.3 eV的第一个过程可能与穿过BOX的带正电的离子传输有关,活化能为约1.2 eV的第二个过程与空间电荷极化有关。已经发现,当在高于280℃的温度下对结构施加偏压时,在BOX /衬底界面附近的横向正电荷积累过程同时产生离子迁移。

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