...
首页> 外文期刊>Microelectronics & Reliability >Current reliability issues and future technologies for systems on silicon-processes, circuits, chip architecture, and design
【24h】

Current reliability issues and future technologies for systems on silicon-processes, circuits, chip architecture, and design

机译:硅工艺,电路,芯片架构和设计上的系统的当前可靠性问题和未来技术

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

The progress of silicon technology is opening the ear of "systems on silicon" in which a large-scale memory, a CPU, and other logic macors will be integrated on a single chip. These kinds of chips, called system LSIs, have an especially promising future in mobile and multimedia applications but face inherent technical problems related to the reliability of ultrathin oxide film, conflict in the processing of different components, increased gate and subthreshold leakage currents, memory bottlenecks, and design complexity. This paper reviews the system LSIs and then introduces related technologies in processing circuits, chip architecture, and design. It also discusses the influence of the system LSIs on business strategies.
机译:硅技术的进步正在打开“硅系统”的大门,在该系统中,大型存储器,CPU和其他逻辑电路将集成在单个芯片上。这些称为系统LSI的芯片在移动和多媒体应用中具有特别广阔的未来,但面临与超薄氧化膜的可靠性,不同组件的处理中的冲突,栅极和亚阈值泄漏电流增加,存储瓶颈有关的内在技术问题。 ,并且设计复杂。本文回顾了系统LSI,然后介绍了在处理电路,芯片架构和设计方面的相关技术。它还讨论了系统LSI对业务策略的影响。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号