Mechanisms of noise sources in microelectrmechanical systems

摘要

It is well known that several mechanisms of noise generation appear in microelectronic devices, causing thermal noise, shot noise, generation-recombination noise and 1/f noise. Besides these noises, in the case of microelectro-mechanical systems, specific additional noises appear as a consequence of the fact that the "building blocks" (microcantilevers or membranes) of micromechanical system have very small geometrical dimensions and mass. Most often, these noises are the consequences of temperature fluctuations caused by dissipative processes in various vibrational structures within the micromechanical systems and applies it to the calculation of limiting performances of accelerometers, sensing probe cantilevers and thermal infrared detectors.