Reliability Studies on Multilevel Interconnection with Intermetal Dielectric Air Gaps

摘要

We present simulation results for the mean time to failure (MTTF) in structures consisting of aluminum intercon- nect lines with air gaps deliberately introduced in the intermetal passivation. The obtained increase in MTTF was explained by a reduction in effective elastic modulus caused by air gap--induced softening of the confinement. Simu- lation results qualitatively fit to performed measurements.