Reliability of Flip Chip Applications with Ceramic and Organic Chip Carriers

摘要

The paper deals with four primary failure mechanisms, namely thermomechanical fatigue, electromigration, thermomigration, and cyclic creep, listed in order of severity I terms of their effect on the reliability of flip-chip solder joints as well as second-level packaging interconnections. It is basically a tutorial review of the mechanisms and the reliability-models, developed semi-empirically over the years, based on experimental data obtained under accelerated conditions and on the physics of the mechanisms.