Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling

摘要

There is an increasing reliability concern of thermal stress-induced and electromigration-induced failures in mul- tilevel interconnections in recent years. This paper reports our investigations of thin film cracking of a multilevel in- terconnect due to fast temperature cycling and electromigration stresses. The fast temperature cycling tests have been performed in three temperature cycle ranges. The failure times are represented well by a Weibull distribution. The distributions are relatively well behaved with generally similar slope (shape factor).