Chip on flex attachment with thermoplastic ACF for RFID applications

摘要

A low -cost method for producing a radio frequency identification (RFID) transponder was studied by using a flip chip bonder to attach chips with thermoplastic anisotropic conductive film (ACF) on a flexible PET substrate. Varying bonding temperature, time, and pressure, nine different test series were made. The test assemblies were Subjected to a constant humidity test and to a temperature cycling test to evaluate their reliability. The joints were Studied using resistance measurements and a scanning electron microscope.