Current market conditions demand that hard disk drive (HDD) manufactures adopt advanced technology in every are of drive design to improve drive caopactity and performance and simultaneously reduce unit cost. Head stack suppliers in HDD industry are constantly working on high density interconnect technologies to provide faster and higher capacity and cheaper head stack components for disk drives. A low cost method to manufacture HDD head using anisotropic conductive film (ACF) bonding for flex-to-flex interconnection has been developed.
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