Recently, preventing environmental pollutions, lead-free (Pb-free) solders are about to replace tin-lead (Sn-Pb) eutectic solders. However, the mechanical properties of Pb-free solders have not been clarified. Hence, the following study was conducted; first, a rate-dependent plasticity was characterized to represent the inelastic deformation behavior for Sn-Ag-based lead-free solders. The material parameters in a constitutive model were determined in a direct method combining both rate-dependent and rate-independent plastic strains.
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