A novel, zone based process monitoring method for low cost MCM-D substrates manufactured on large area panels

摘要

this paper describes a novel process monitoring method for low cost MCM-D substrates. By using large area panel processing the EU LAP project aims to reduce the manufacturing costs and to reach the target of 1 USS/in.~2. To achieve this cost reduction an efficient process control is essential to guarantee a high substrate yield. But when the panel size is increased from 4x4 up to 24x24 in.~2, the non-uniformity of process parameters is also increased, and new process monitoring challenges arise. Conventional methods, such as placing monitor structures along the panel border or inside the panel area, do not provide enough coverage of the panel centre or may require too much real estate.