Wirebond profiles characterized by a modified linkage-spring model which includes a looping speed factor

摘要

The linkage-spring model based on a quasi-static looping has been used to determine the design rules to reduce the loop heights and the sagging altitude of gold wire in the package. In order to further simulating the capillary trajectory which includes a looping speed factor from the first bond to the second bond stages, a linkage-spring model is modified in this study. The factors of the inertia mass and variations in material properties with different strain-rates need to be considered due to a high speed looping. It is found that the looping speed effects on the wirebond profiles due to the inertia mass can be neglected at a regular Looping process of 3-5g acceleration even up to around 10g acceleration.