Methodology for predicting solder joint reliability in semiconductor packages

摘要

A new experimental method for detecting solder joint strain in package assemblies using digital image correlation metrology has been developed. A new methodology is proposed which utilizes strain data generated by this technique for predicting solder joint fatigue life for any desired package configuration based on a reference configuration. This approach as significant practical appeal since it obviates brute-force temperature cycle testing for the qualification of every new variation of an existing package configuration. In this paper, we describe the principle, experimental set-up and sample preparation techniques for this method.