Integrated electro-thermomechanical analysis of nonuniformly chip-powered microelectronic system

摘要

An integrated electrical, fluid flow and thermomechanical analysis is presented to study a product reliability and thermal management solution in an actural or nonuniform chip power distribution of an integrated circuit device in a realistic system application environment. This study aims to improve the existing limitations both on electrothermal analysis where simplified thermal boundary conditions is mostly used and on the current thermal and fluid flow analysis where uniform chip power is widely used to calculate the temperature.