Thermally driven reliability issues in microelectronic systems: status-quo and challenges

摘要

To meet the needs of future microelectronics and microsystems, we need a paradigm shift in the approach to system reliability. It is emphasized that the scientific success of many nano/micro-related projects will never lead to a business success without breakthroughs in the way industry is handling quality and reliability through the whole value chain. The paper discusses several reasons for these facts and offers a perspective for future improvements. The paper is essentially a mix between an overview paper and some personal observations in an editorial style.