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New insights into the change of voltage acceleration and temperature activation of oxide breakdown

机译:关于电压加速和氧化物击穿温度激活变化的新见解

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A large database of time-dependent dielectric breakdown study was conducted on 50 A SiO_2 film over a wide range of temperature (125-300 ℃) and a large range of voltage stress (-4.4 to -6.8 V). Using an accurate methodology, we suppress any correlation between voltage and temperature dependence of the voltage acceleration factor and the activation energy. A possible origin of the non-Arrhenius temperature dependence is discussed and a valid window for E-model lifetime prediction is defined. This study shows the high temperature impact on the reliability projection and point at the difficulty to predict the time-to-breakdown using activation energy as an extrapolation parameter.
机译:在50 A SiO_2薄膜上,在较大的温度范围(125-300℃)和较大的电压应力范围(-4.4至-6.8 V)上,进行了随时间变化的介电击穿研究的大型数据库。使用精确的方法,我们抑制了电压和电压依赖于加速因子和活化能的温度之间的任何相关性。讨论了非阿累尼乌斯温度依赖性的可能起源,并定义了E模型寿命预测的有效窗口。这项研究显示了高温对可靠性预测的影响,并指出了使用活化能作为外推参数来预测击穿时间的困难。

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