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Improvement of integrated circuit testing reliability by using the defect based approach

机译:通过使用基于缺陷的方法来提高集成电路测试的可靠性

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The systematic decrease in the minimum feature size in VLSI circuits makes spot defects an increasingly significant cause of ICs' faults. A testing method optimized for detecting faults of this origin has been recently developed. This method, called defect based testing (DBT), requires a lot of computational effort at the stage of testing-procedure preparation, which makes it appear less attractive than the well-known stuck-at-fault oriented testing. This paper, however, shows that a stuck-at-fault-optimized test-vector set may prove highly inefficient in detecting spot-defect-induced faults. Experiments with the C17 ISCAS-85 testability benchmark show that the risk of a spot-defect damaged circuit passing the test is dangerously high if the test set was designed with stuck-at-faults in mind. It is also shown that although spot defects may in some cases transform a combinational circuit into a sequential one, in practice this phenomenon does not require any special treatment from the test designer. Eventually, a few methods are discussed that make the DBT less time consuming.
机译:VLSI电路中最小特征尺寸的系统减小使斑点缺陷成为IC故障的日益重要的原因。最近已经开发出一种优化用于检测该起源故障的测试方法。这种方法称为基于缺陷的测试(DBT),在测试过程准备阶段需要大量的计算工作,这使其不如众所周知的面向故障的测试有吸引力。但是,本文表明,故障锁定优化的测试向量集在检测点缺陷引起的故障方面可能被证明是非常低效的。使用C17 ISCAS-85可测试性基准进行的实验表明,如果设计测试装置时要牢记故障,则斑点缺陷损坏的电路通过测试的风险非常危险。还表明,尽管在某些情况下斑点缺陷可能会使组合电路变成顺序电路,但实际上,这种现象不需要测试设计人员的任何特殊处理。最终,讨论了一些使DBT​​耗时更少的方法。

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