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Characterisation of series resistance degradation through charge pumping technique

机译:通过电荷泵技术表征串联电阻的退化

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摘要

The nature of hot carrier degradation in the spacer oxide of lightly doped drains n-MOSFETs is investigated. Damage in the spacer reveals a two-stage drain series resistance degradation with an early stage lasting about 100 ms for the technologies under consideration. Further a two-stage interface state generation separated by saturation between 1 and 10 s is observed for V_g = V_d stress condition. The co-relation between the charge pumping measurements and the drain series resistance for different stress condition is studied to investigate the nature of spacer damage. It is seen that under V_g ~ V_t and I_(submax) stress conditions, the damage is predominantly by interface state generation. Under V_g = V_d stress condition the damage can be attributed to both interface state generation and trapping.
机译:研究了轻掺杂漏极n-MOSFET的间隔氧化物中热载流子降解的性质。隔离层中的损坏显示出两级漏极串联电阻降低,对于正在考虑的技术,其早期持续约100 ms。在V_g = V_d应力条件下,还观察到两步界面状态的产生,饱和状态在1到10 s之间。研究了在不同应力条件下电荷泵浦测量与漏极串联电阻之间的相互关系,以研究隔离层损坏的性质。可以看出,在V_g〜V_t和I_(submax)应力条件下,损伤主要是由于界面状态的产生。在V_g = V_d应力条件下,损坏可归因于界面状态的产生和陷获。

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