Full ball shear metrology as defect detection and analysis tool for solder joint reliability assessment on direct immersion gold technology

摘要

Direct Immersion Gold (DIG) technology was developed as alternative surface finish for flip chip ball grid array substrate to address brittle solder joint issue resulted from Electroless Nickel Immersion Gold (ENIG) surface finish. This paper will discuss the defect detection metrology of Full Ball Shear as a breakthrough analysis for tiny voids in order to assess solder joint reliability of DIG substrates and its success of identifying potential solution path for tiny void issue.