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Standard and C-AFM tests to study the post-BD gate oxide conduction of MOS devices after current limited stresses

机译:标准和C-AFM测试,以研究电流受限应力后MOS器件的BD栅氧化后导电

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In this work, we have combined standard electrical tests with C-AFM experiments on SiO_2 gate oxides to investigate the influence of the nanometer scale conduction parameters (in particular, the area affected by the breakdown event, S_(BD)). to the overall oxide post-BD conduction, I_(BD), measured on microelectronic sized devices for a wide range of current limits. Although a relation between both parameters can be established, the results show that the total current flowing through the BD spot is mainly determined by the conductivity at the oxide position where it is initially triggered.
机译:在这项工作中,我们将标准电学测试与针对SiO_2栅氧化物的C-AFM实验相结合,以研究纳米级导电参数(特别是受击穿事件影响的面积S_(BD))的影响。 BD导电后的总氧化物I_(BD),在微电子大小的器件上测量了很宽的电流限制。尽管可以建立两个参数之间的关系,但是结果表明,流过BD点的总电流主要由最初触发它的氧化物位置的电导率决定。

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