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Experimental characterization of temperature distribution on Power MOS devices during Undamped Inductive Switching

机译:无阻尼感应开关过程中功率MOS器件温度分布的实验表征

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摘要

In this paper we present experimental results of dynamic thermal mapping for the characterization of electrothermal behaviour of new power MOSFET devices during Undamped Inductive Switching. Based on a suitable electrical driving circuit and on a direct radiometric detection of the device temperature, the proposed system is able to acquire the temperature map over the dye area with high spatial (less than 10 μm) and time (less than 2μs) resolution, and good temperature (less than 1℃) resolution. This capabilities are confirmed by the results reported in the paper, where two different low voltage (less than 60V) low on-resistance (less than 10mΩ) multi-cellular power MOSFETs devices have been tested. Uneven temperature distributions due to differences in dye size and dissipated power have been detected during the UIS transient.
机译:在本文中,我们介绍了动态热映射的实验结果,以表征新型功率MOSFET器件在无阻尼感应开关过程中的电热行为。基于合适的电驱动电路和对设备温度的直接辐射检测,所提出的系统能够以高空间分辨率(小于10μm)和时间分辨率(小于2μs)获取整个染料区域的温度图,良好的温度(低于1℃)分辨率。该论文报告的结果证实了这种能力,其中对两种不同的低电压(小于60V)低导通电阻(小于10mΩ)多单元功率MOSFET器件进行了测试。在UIS瞬态过程中检测到由于染料尺寸和耗散功率差异而导致的温度分布不均。

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