Reliability of Low-Cost PCB Interconnections for Telecommunication Applications

摘要

Today the low cost PCB interconnections are widely used for domestic telecommunication applications. These technologies are limited by the possible variation of the performances of substrates and metallization during operating life. The knowledge of the behaviour of these parameters under stress conditions allows to optimise the design safety margins and to predict a probable lifetime. In this paper we show that the proposed structures (rings and stub resonators) could be used to discriminate the degradation sources.