Time-independent elastic-plastic behaviour of solder materials

摘要

For a long time, constitutive modelling of solders has focused onto the elastic and creep properties. Indeed, the creep model describes the behaviour of solder joints under thermal cycling quite properly. However, in applications such as hand held electronic devices or automotive products, the pure mechanical impact like shock, bending and twisting may even matter more than sole thermo-mechanical fatigue. Therefore the time-independent behaviour of SnPb37, SnAg3.5 and SnAg4Cu0.5 has been investigated on flip chip solder joints. In the experimental tests a cyclic triangular strain wave with constant frequency but different amplitudes was used as the load function. This way the test enables to account for Bauschinger effects. The strain wave amplitudes ranged from Δε = 0.25% to 4%, the strain wave frequency was fixed at f = 1 Hz. The test temperature ranged from T = 5 to 50℃. The test specimen consisted of two silicon chips (3.3x3.3 mm~2) bonded by 4 flip chip joints (one at each corner). A specially designed Micro Shear Tester has been used for the experiments with this type of specimen. In contrast to similar setups, it is actively compensated for its finite stiffness. Therefore, it is able to record force-displacement hysteresis with a resolution of better than 1 mN and 20 nm, respectively. Based on these measurements, the parameters of the constitutive equations have been evaluated by FEM analysis. This way, the complex stress state within the sample during the test has been considered precisely providing for high accuracy of the parameter extracted. As a typical application, a three point bending experiment has been simulated by FEM applying different constitutive models for the solder material. Comparing the results, it becomes clear: All the three contributions, i.e., the elastic, the creep, and the time-independent plastic material behaviour, are required in the model. Otherwise it would be incomplete and hence insufficient for assisting in the design of today's electronics packages even with respect to the most frequent load cases.