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High-resolution transmission electron microscopy on aged InP HBTs

机译:老化的InP HBT的高分辨率透射电子显微镜

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摘要

We have used high-resolution transmission electron microscopy (HRTEM), with focused-ion-beam preparation of foils, to study InP HBT devices, both as-fabricated and after aging in life tests. The technology is HRL's G1 process. We found that even after aging for the equivalent of 2x10~7 h under normal operating conditions, the visible damage is extremely benign: the base and emitter contacts are completely intact, there is no evidence of significant Au or Pt migration into the semiconductor, and minor crystal disorder that develops does not extend more than 100 nm below the metal-semiconductor interfaces. Except for these regions, the intrinsic devices are completely devoid of any anomalous features, to within the 0.3 nm resolution limit of the measurements. These observations provide strong evidence that failure mechanisms involving migration of metal from the ohmic contacts, or extended crystal defects, do not limit the reliability of this technology. The small disorder under the base contacts can probably explain the increases of gain (β) observed early in our life tests, and small increases in the base-collector leakage occurring later in the life tests. The minor disorder under the emitter contacts can probably explain the moderate increase of emitter resistance observed late in our life tests. But the mechanism for the eventual decline in β, observed after a long period of stress, for the equivalent of 10~7 h of normal operation, is not apparent from the HRTEM images.
机译:我们已经使用高分辨率透射电子显微镜(HRTEM)和聚焦离子束箔片来研究InP HBT器件,包括在制造中以及在寿命测试中进行老化后的情况。该技术是HRL的G1流程。我们发现,即使在正常工作条件下老化2x10〜7小时后,可见的损伤也极为温和:基极和发射极触点完全完好无损,没有证据表明Au或Pt大量迁移到半导体中,并且所形成的微小晶体失序在金属-半导体界面下方的延伸范围不超过100 nm。除这些区域外,本征器件完全没有任何异常特征,处于测量值的0.3 nm分辨率范围内。这些观察结果提供了有力的证据,证明了涉及金属从欧姆触点迁移或扩展的晶体缺陷的失效机制不会限制该技术的可靠性。基本触点下方的小故障可能可以解释在我们的寿命测试中早期观察到的增益(β)的增加,以及寿命测试后期出现的基极-集电极泄漏的小幅增加。发射极触点下方的细微混乱可能可以解释在我们的寿命测试后期观察到的发射极电阻的适度增加。但是从HRTEM图像来看,经过长时间的应力观察,相当于正常运行10〜7小时,β最终下降的机理尚不明确。

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