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Rigorous modeling of high-speed semiconductor devices

机译:高速半导体器件的严格建模

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摘要

We present a review of industrial heterostructure devices based on SiGe/Si and Ⅲ-Ⅴ compound semiconductors analyzed by means of numerical simulation. A comparison of device simulators and current transport models is given and critical modeling issues are addressed. Results from two-dimensional hydrodynamic analyses of heterojunction bipolar transistors (HBTs) are presented in good agreement with measured data. The examples are chosen to demonstrate technologically relevant issues which can be addressed by device simulation.
机译:本文介绍了基于SiGe / Si和Ⅲ-Ⅴ族化合物半导体的工业异质结构器件的数值模拟方法。给出了设备模拟器与当前传输模型的比较,并解决了关键的建模问题。异质结双极晶体管(HBT)的二维流体动力学分析结果与实测数据非常吻合。选择这些示例以说明可以通过设备仿真解决的技术上相关的问题。

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