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Electroluminescence spectroscopy for reliability investigations of 1.55 μm bulk semiconductor optical amplifier

机译:电致发光光谱法用于1.55μm体半导体光放大器的可靠性研究

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摘要

This paper demonstrates the complementary relation between functional parameters and electroluminescence spectroscopy for reliability investigations of 1550 nm Semiconductor Optical Amplifiers of 700 μm length active region. Ageing tests have been set to 270 mA-100℃-1500 h and realized on two different wafers showing more impact on wafer 1 than on wafer 2. Our investigations are particularly focused on interpretation of electroluminescence spectra, from reference and aged SOAs of wafer 1, leading to an improvement of degradation mechanisms understanding. The shift rate to lower energies of the recombination energy peak at 1550 nm, as reported by electroluminescence spectra between reference and aged SOAs in relation with the decrease of optical power measured at 200 mA for the degraded SOA and completed by Ⅰ(Ⅴ) characterizations, suggest occurrence of non radiative deep centers near the buried ridge structure in relation with the cleaning process uniformity of interfaces before epitaxial overgrowth. These defects mainly trap majority injected carriers instead of minority carriers reducing the luminescence in the active zone. By monitoring the most sensitive failure indicator (pseudo-threshold current), lifetime distributions are also calculated to determine failure rate, between 150 and 200 FITs over 15 years for operating conditions (25℃-200 mA) using experimental degradation laws and statistic computations, demonstrating the overall robustness of this technology.
机译:本文演示了功能参数与电致发光光谱之间的互补关系,以研究1550 nm长度为700μm有源区的半导体光放大器的可靠性。老化测试已设置为270 mA-100℃-1500 h,并且在两个不同的晶片上实现了更大的影响,对晶片1的影响比对晶片2的影响更大。我们的研究尤其着眼于从参考和老化的晶片1的电致发光光谱的解释,从而提高了对降级机制的理解。参考和老化的SOA之间的电致发光光谱报告,在1550 nm处重组能量峰向较低能量的转移速率与降解的SOA在200 mA下测得的光功率的降低有关,并通过Ⅰ(Ⅴ)表征完成,认为在外延生长之前,埋入的脊结构附近会出现无辐射的深中心,这与界面的清洗过程均匀性有关。这些缺陷主要俘获了注入的多数载流子,而不是少数载流子,从而降低了有源区的发光。通过监视最敏感的故障指示器(伪阈值电流),还可以使用实验退化规律和统计计算来计算寿命分布,以确定在15年内工作条件(25℃-200 mA)下150至200 FITs的故障率,展示了该技术的整体健壮性。

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