Die repackaging for failure analysis

摘要

This paper presents different methods of preparation to repack dice with a non destructive access to the backside. With new processes, and where backside milling is not possible, this work is mandatory for any fault localisation technique. Various mountings, to be chosen depending on the original package (mainly BGA) and on the requirements of the emission techniques, will be described. We will see also how these techniques could be used for a new product family: the System In Package (multiple dice inside a package). In this case the challenge is to extract the failed die without destroying the module.