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Impact of semiconductors material on IR Laser Stimulation signal

机译:半导体材料对红外激光刺激信号的影响

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摘要

In failure analysis laboratory, infrared laser stimulation techniques are more and more used for performing accurate defect localization on IC surface. Signatures obtained on metallic elements are well known, but weak data are available on signatures of semiconductors elements. Our investigations consist of studying impact of semiconductors materials on IR Laser Stimulation signal during a failure analysis. Frontside and backside Thermal Laser Stimulation (TLS) experiments were performed on n+/p+ diffusion and polycrystalline resistors from 0.18μm technology, both silicided (CoSi_2) and unsilicided. Experimental results are presented and discussed for different W/L ratios. The impact of different semiconductors materials on TLS measurements is discussed and verified by experiment.
机译:在故障分析实验室中,越来越多地使用红外激光刺激技术在IC表面进行精确的缺陷定位。在金属元件上获得的签名是众所周知的,但是在半导体元件的签名上却可获得微弱的数据。我们的研究包括在故障分析过程中研究半导体材料对IR激光刺激信号的影响。在硅化(CoSi_2)和未硅化的0.18μm技术的n + / p +扩散和多晶电阻上进行了正面和背面热激光刺激(TLS)实验。给出并讨论了不同W / L比的实验结果。讨论并通过实验验证了不同半导体材料对TLS测量的影响。

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