Prediction of Delamination Related IC & Packaging Reliability Problems

摘要

This paper presents our effort to predict delamination related IC & packaging reliability problems. These reliability problems are driven by the mismatch between the different material properties, such as thermal expansion, hygro -swelling, and/or the degradation of interfacial strength. First of all, a test technique is presented to measure the interfacial strength between packaging materials. Secondly, several reliable non-linear Finite Element models are developed, able to predict the reliability impact of delamination on wire failures, different package structures, and passivation cracks in IC-packages.