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Seebeck Effect Detection on Biased Device without OBIRCH Distortion Using FET Readout

机译:使用FET读数在无OBIRCH失真的偏置设备上进行Seebeck效应检测

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摘要

Laser Stimulated Seebeck Effect Imaging (SEI) is widely used in Microelectronics Failure Analysis, namely when performed through chip backside. The SEI signal shapes are often not easy to interpret though, mostly because of superposition of additional OBIRCH (Optical Beam Induced Resistivity Change). Here, a SEI detection technique independent of OBIRCH interference is presented. When a thermoelectric voltage is generated on an interconnect that drives FET inputs (gate conductor), the voltage influences the FET channel conductance almost currentless producing drain output shift that can be detected as Thermal Laser Stimulation (TLS) signal. As FET output current is clearly separate from the gate, it cannot interfere with the thermoelectric effects in the gate conductor. A full characterization of the structure for several circuit models is presented. Test structures for SEI may be improved when designed with FET readout. Also on ICs SEI can be done with nominal supply voltage as long as the Seebeck junction is located in a gate conductor circuit.
机译:激光激发塞贝克效应成像(SEI)被广泛用于微电子学故障分析中,即通过芯片背面执行时。 SEI信号的形状通常不容易解释,主要是因为附加的OBIRCH(光束感应电阻率变化)的叠加。在此,提出了一种独立于OBIRCH干扰的SEI检测技术。当在驱动FET输入(栅极导体)的互连上产生热电电压时,该电压几乎会无电流地影响FET通道电导,从而产生漏极输出偏移,可以将其检测为热激光刺激(TLS)信号。由于FET输出电流明显与栅极分开,因此它不会干扰栅极导体中的热电效应。给出了几种电路模型的结构的完整描述。使用FET读数进行设计时,可以改善SEI的测试结构。同样,只要Seebeck结位于栅极导体电路中,就可以用标称电源电压完成SEI。

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