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The impact of static and dynamic degradation on SOI 'smart-cut' floating body MOSFETs

机译:静态和动态降级对SOI“智能切割”浮体MOSFET的影响

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摘要

The impact of static (DC) and dynamic (AC) degradation on SOI "smart-cut" floating body MOSFETs, was investigated by means of deep level transient spectroscopy (DLTS). The study was based on drain current signal recording, immediately after the transistor transition from OFF- to ON-state. In order to isolate the activity of capture/emission carrier mechanisms, undesirable parasitic effects such as drain current overshoot were suppressed by appropriately biasing the transistor substrates. Under DC degradation regime, DLTS spectra disclosed that carrier capture/emission process occurred through discrete traps governed by thermally activated mechanisms. Furthermore, polarization phenomena emerged. Under AC degradation regime, although the existence of interface states in Si-SiO2 interface was dominant, the revelation of shallow traps in low temperature domain was also monitored.
机译:通过深电平瞬态光谱法(DLTS)研究了静态(DC)和动态(AC)退化对SOI“智能切割”浮体MOSFET的影响。该研究基于漏极电流信号记录,即晶体管从截止状态转换为导通状态后立即进行的。为了隔离捕获/发射载流子机制的活动,通过适当地偏置晶体管衬底来抑制不希望的寄生效应,例如漏极电流过冲。在DC降解机制下,DLTS光谱揭示了载流子捕获/发射过程是通过受热激活机制控制的离散阱发生的。此外,出现了极化现象。在交流降解条件下,尽管Si-SiO2界面中界面态的存在占主导地位,但也监测了低温域中浅陷阱的揭示。

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