Failure Analysis Issues in Microelectromechanical Systems (MEMS)

摘要

Failure analysis and device characterization of MEMS components are critical steps in understanding the root causes of failure and improving device performance. At the wafer and die level these tasks can be performed with little or no sample preparation. Larger challenges occur after fabrication when the device is packaged, capped, sealed, or otherwise obstructed from view. The challenges and issues of MEMS failure analysis lie in identifying the root cause of failure for these packaged, capped, and sealed devices without perturbing the device or its immediate environment. Novel methods of gaining access to the device or preparing the device for analysis are crucial to accurately determining the root cause of failure. This paper will discuss issues identified in performing root cause failure analysis of packaged MEMS devices, as well as the methods employed to analyze them.