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Analysis of triggering behaviour of high voltage CMOS LDMOS clamps and SCRs during ESD induced latch-up

机译:ESD引起的闩锁期间高压CMOS LDMOS钳位和SCR的触发行为分析

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Current flow uniformity during ESD induced latch-up event is investigated in multi-finger LDMOS clamps and SCR ESD protection devices fabricated in a 0.6 μm high voltage CMOS process. Current flow, excess free carrier and hot spot distribution are analyzed by transient interferometric mapping technique combined with a latch-up pulse system consisting of a solid state pulser and a clear pulse unit. During latch-up, the current in the LDMOS clamps flows just in a single spot and the failure position is random and independent on device type. The position of the failure site correlates with the trigger position of the device. The SCRs exhibit pulse-to-pulse instabilities in the current flow.
机译:在采用0.6μm高压CMOS工艺制造的多指LDMOS钳位和SCR ESD保护器件中,研究了ESD引起的闩锁事件期间的电流均匀性。电流瞬态,多余的自由载流子和热点分布是通过瞬态干涉映射技术结合由固态脉冲发生器和净脉冲单元组成的闭锁脉冲系统进行分析的。在闩锁期间,LDMOS钳位电路中的电流仅在一个点流动,并且故障位置是随机的,并且与器件类型无关。故障部位的位置与设备的触发位置相关。 SCR在电流中表现出脉冲间的不稳定性。

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