Electron BackScattered Diffraction (EBSD) use and applications in newest technologies development

摘要

Electron BackScattered Diffraction (EBSD) is a Scanning Electron Microscopy (SEM) based technique where diffraction patterns of backscattered electrons are collected on a screen and analyzed. This paper presents how EBSD provides quantitative and local information about metal texture, grain size, grain boundaries and twins. The application of the EBSD technique to copper layers texture characterization at SEM resolution scale shows outstanding results on both full sheet and patterned wafers. It helps process engineers and integration teams to improve devices yield and reliability.