Support excitation scheme for transient analysis of JEDEC board-level drop test

摘要

We propose in this paper the support excitation scheme for analyzing transient structural responses of electronic components subjected to JEDEC board-level drop test conditions. Equations of motion of the board-level test vehicle are derived based on coordinate transformations that translate the input acceleration pulse into the effective support excitation load on the test vehicle. In this way, modeling of the drop table along with calculations for the impact force on the drop table through contact methodologies can be omitted. Furthermore, either an explicit or an implicit solver works for the numerical model. Compared with the conventional numerical treatment for board-level drop tests, this novel methodology provides computationally economical solutions. With the support excitation scheme implemented, numerical studies are carried out to investigate efficiencies of implicit and explicit time integration schemes, solution accuracies with respect to the mesh density of the test board, and effects of drop orientations as well as structural damping on transient structural responses of a board-level chip-scale package subjected to the JEDEC drop test condition.